Fault isolation techniques for electrical and MEMS devices require the ability to identify the fault location, identify the nature of the fault and isolate the defective section for more in depth fault analysis.

Shrinking metal pitches and device sizes, increasing metal layers and increasing clock frequencies all create added difficulties in fault isolation.

Micromanipulator provides system which support the identification and isolation of electrical and MEMS faults. Below is a partial list of systems which support fault isolation tests.

• FA-2000 Emission Microscope System - Identify fault locations at wafer, die, de-lidded package level on a probe station or being actively driven in a test head
• H1000 Thermal Chuck System - Identify fault locations with liquid crystal tests and with accelerated electrical testing
• New Wave Laser Cutters on 4000/8000/P200-300 Series Stations - Isolate defective sections for more in-depth electrical testing and remove metal layers
• P200A/P300A Semiautomatic Stations and Optical Fiber Holders - Fault detection through optical or IR beam induced current
• 8000/P200-300 Series Low Current Probe Systems - Identify low level leakage sites
• 44RF and Picoprobe® High Frequency Probes - Identify RF/high frequency devices not performing to specifications
• 4000/8000 Series MEMS Workstations and Motion Analysis Systems - Identify MEMS motion failures