System Level/Packaged Part

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  • VERSA Double Sided Probe System

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    • Worlds most versatile probe station
    • Double sided probing and imaging
    • Probe decapsulated IC’s, wafers, and large boards up to 26″ square, all at temperature.
    • -40C to 125C configurable
    • Integrated vibration isolation platform
    • Magnetic field options
    • Patented
    • Integration with popular high-resolution emission microscope to pinpoints failure locations, top down and DSP, with temperature too!

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  • VERSA Modular Probe System

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    • Based on the world’s most versatile probe system
    • Customized thermal options – Hot & Cold (frost free)
    • Integrated vibration isolation platform
    • Modular designed allows for all device testing such as:
    • Backside & Double Sided.
    • High-speed signal acquisition.
    • Use as an optical inspection platform.
    • High-power, DC, high frequency, & mmW.
    • Test wafers, boards, pieces, packaged parts, & individual die, all at temperature.
    • Integration with popular high-resolution emission microscope to pinpoints failure locations, top down and DSP, with temperature too!

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