Innovative Thermal Wafer Chuck Systems
Micromanipulator offers a range of thermal wafer chuck systems that can be configured to meet your performance, budget or probing application requirements. The wafer chucks are specifically designed as part of the comprehensive system integration for your probe station of choice. The wafer chuck design features: rapid heat up and cool down; minimizes expansion into the probes; maintains incredible planarity over temperature changes with our Frictionless Kinematic Mount; and minimizes heat radiation into the stage to prolong prober life.
Product Documents: micromanipulator-h1000-thermal-chuck-systems
|Temperature range||Probe Station Compatibility||Configuration Options|
|Ambient to 400C||All models||Coaxial and Triaxial DC quiet drive or economical AC 150mm, 200mm|
|0C to 400C||All models||Coaxial and Triaxial DC quiet drive or economical AC 150mm, 200mm|
|-65C to 400C||4060, 8060, P200L, P200A||Coaxial and Triaxial DC quiet drive or economical AC 150mm, 200mm|
|-55C to 300C||P300J, P300A, P300L||Coaxial and Triaxial DC quite drive or economical AC 300mm|
Wafer Chuck Systems for Any Probing Applications
The H1000 series thermal wafer chuck is a Micromanipulator exclusive design and leads the wafer probing industry with the best planarity, lowest noise, and lowest cost of ownership available. Systems support wafer testing from -65 to 400 degrees C, and several configurations are available to fit your application and budget.
Wafer Chuck Systems include a choice of:
- AC heating power supply for fast heating when chuck noise in the fA level is not needed, or a DC heating supply to achieve the very lowest level measurements.
Several cooling options:
- The C1000 simple heat exchanger (HE) cooling is the economical choice if your requirements are only for above ambient testing. This heat exchanger provides rapid cool down of the chuck to near room temperature after a heat cycle is finished.
- The C1000 zero degree option for testing to zero degrees.
- The HC1000 high performance cooling system to test at temperatures down to -65 degrees C.
If you do not see the information you need regarding our wafer chuck systems, please give us a call. Our engineers will be happy to answer any questions you may have.
Micromanipulator not only invented analytical probing in 1956 but we are the leading name in the field. We reliably deliver the tools and life cycle support the semiconductor industry depends on. Part of our company’s philosophy and what drives our success is an unfaltering commitment to our customers’ satisfaction. You will find we have the most comprehensive range of accessories available including our exclusive H1000 series thermal wafer chuck.